发明名称 |
Method of Producing Silicon Blocks and Silicon Wafers |
摘要 |
In a method of producing silicon blocks by cutting a silicon ingot by the use of a silicon ingot cutting slurry containing abrasive grains and an alkaline substance so as to provide the silicon blocks that can be produced into silicon wafers each having a thin thickness with reduced substrate damage at the time of producing a solar battery, the content of said alkaline substance is at least 3.5 mass % with respect to the mass of the entire liquid components of said slurry, and said slurry contains an organic amine of from 0.5 to 5.0 by a mass ratio with respect to water in the liquid components of said slurry. Said slurry is used at a pH of 12 or more and at a temperature of from 65 to 95 degrees C.
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申请公布号 |
US2008223351(A1) |
申请公布日期 |
2008.09.18 |
申请号 |
US20050884121 |
申请日期 |
2005.05.11 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION |
发明人 |
MORIKAWA HIROAKI;KARAKIDA SHOICHI;KAWASAKI TAKAFUMI |
分类号 |
B28D1/00 |
主分类号 |
B28D1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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