发明名称 METHOD OF COATING APPLICATION, COATING APPLICATION APPARATUS AND COMPUTER READABLE STORAGE MEDIUM
摘要 <p>In the coating step, a substrate is rotated at a high speed, and while maintaining the condition, a resist liquid is spouted through a first nozzle onto a central area of the substrate to thereby attain application of the resist liquid onto the substrate. In the subsequent planarizing step, the rotating speed of the substrate is decreased, and the resist liquid on the substrate is planarized by rotating the substrate at a low speed. The spouting of the resist liquid through the first nozzle in the coating step is continued until the middle of the planarizing step. In the discontinuation of the spouting of the resist liquid in the planarizing step, the first nozzle is shifted so as to shift the position of spouting of the resist liquid from the central area of the substrate. Accordingly, the resist liquid can be applied uniformly within the plane of the substrate.</p>
申请公布号 WO2008111400(A1) 申请公布日期 2008.09.18
申请号 WO2008JP53503 申请日期 2008.02.28
申请人 TOKYO ELECTRON LIMITED;YOSHIHARA, KOUSUKE;ISEKI, TOMOHIRO;TAKAYANAGI, KOJI 发明人 YOSHIHARA, KOUSUKE;ISEKI, TOMOHIRO;TAKAYANAGI, KOJI
分类号 H01L21/027;B05D1/40;G03F7/16 主分类号 H01L21/027
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