| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce the defective connection of terminals at the time of mounting electronic parts related to an area bump array package, etc., on a circuit board. SOLUTION: An electrical insulating layer 27 is formed on a circuit board 22 by silk screen printing, etc., in such a way that the layer 27 surrounds a part of a conductor pattern 21 and does not surround the other part of the pattern 21. When cream solder 25 is printed, the thickness of the printed solder on the part of the conductor pattern 21 surrounded by the insulating layer 27 becomes thicker than that at the part of the pattern 21 not surrounded by the layer 27, because the screen 23 of the insulating layer 27 is pushed up. By forming the insulating layer 27 at the portions facing the corner sections of electronic parts which are apt to receive influences of the warp of the circuit board 22 or the electronic parts to be mounted on them, the occurrence of defective connection of terminals resulting from the warp of the board 22 or parts is reduced.</p> |
