发明名称 ELECTRONIC COMPONENT MOUNTING SYSTEM AND ELECTRONIC COMPONENT MOUNTING METHOD
摘要 In an electronic component mounting system configured by connecting a plurality of mounting apparatuses, a substrate ID code given to a substrate by digital data is read by a substrate supplying apparatus in the uppermost stream, and is transmitted to a mounting apparatus in downstream through a communicating means. In the mounting apparatus, the transmitted substrate ID code is compared with the code data (failure substrate code, read error code, dummy substrate code or the like), which is of the substrates not required to be mounted and is previously stored in a storage section, and whether to mount the substrate or not is judged. The substrate judged not to be necessarily mounted is carried out to the downstream without being mounted, without stopping the line.
申请公布号 KR20080083303(A) 申请公布日期 2008.09.17
申请号 KR20087016548 申请日期 2008.07.08
申请人 PANASONIC CORPORATION 发明人 SUMI HIDEKI
分类号 H05K13/08 主分类号 H05K13/08
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