| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a small-sized semiconductor device in which a chip capacitor is directly mounted on a lead frame and has a fail-safe function which restrains possibility of burning of molding resin in the case of short-circuit failure of the chip capacitor. <P>SOLUTION: In a semiconductor device 101, the chip capacitor 3 which is mounted on a part between the lead frame 11 of a power source terminal and a lead frame 21 of a ground terminal is installed and molded with resin 9. At a part between the power source terminal and the ground terminal, overcurrent reacting parts 11h, 21h are arranged in series to a chip capacitor 3. When excess current flows by a short-circuit failure of the chip capacitor 3, the overcurrent reacting parts 11h, 21h are disconnected. <P>COPYRIGHT: (C)2004,JPO&NCIPI</p> |
