发明名称 Method for forming leadframe assemblies
摘要 <p>A method for forming a leadframe assembly (22) is provided. The method includes the steps of providing a sheet (10) of leadframe material and depositing a brazing alloy (12) on a first surface of the sheet (10). The method also includes the steps of placing one or more substrates (16) on the first surface of the sheet (10) and in contact the brazing alloy (12), and heating the brazing alloy (12) to bond the substrate (16) to the first surface of the sheet (10). </p>
申请公布号 EP1798766(A3) 申请公布日期 2008.09.17
申请号 EP20060077173 申请日期 2006.12.05
申请人 DELPHI TECHNOLOGIES, INC. 发明人 DJORDJEVIC, ALEKSANDRA;BERLIN, CARL W.
分类号 H01L23/498 主分类号 H01L23/498
代理机构 代理人
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