| 摘要 |
A bonded patch is bonded on a surface of an inner liner. A first patch wall having a first wall surface for restraining a movement of an electronic device main body in one direction is provided integrally with the bonded patch so as to project toward a tire center. A second patch wall having a second wall surface for restraining a movement of an electronic device main body in another direction is provided integrally with the bonded patch so as to project toward the tire center. A connecting segment is provided between the first patch wall and the second patch wall with bridging them for engaging a top of the electronic device main body. A crack occurrence on the mounting structure is prevented by deconcentrating a force applied on an electronic device to overall of the mounting structure to restrain an intensive stress concentration on the mounting structure.
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