| 摘要 |
A planar wafer based device (e.g., a reflective light valve backplane) is shown in the Figure and includes a substrate having a plurality of surface projections (e.g., pixel mirrors) defining gaps therebetween, an etch-resistant layer formed on the substrate, and a fill layer formed on a portion of the etch-resistant layer in the gaps. A method for manufacturing the planar reflective light valve backplane includes the steps of providing a substrate (e.g., a reflective backplane) including a plurailty of surface projections (e.g., pixel mirrors) defining gaps therebetween, forming an etch-resistant layer on the substrate and a fill layer on the etch resistant layer, etching the fill layer to expose portions of the etch-resistant layer overlying the projections, leaving a portion of the fill layer in the gaps, and optionally forming a protective layer over the exposed portions of the etch-resistant and the fill layers.
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