PELTIER COOLING SYSTEMS WITH HIGH ASPECT RATIO

摘要

New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shapes are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier cold side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such 'high aspect ratio' Peltier systems promote 'focused' cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling face of the Peltier device is brought to the small space approximated by a point. Thus a 'point' heat source such as a semiconductor laser or high-performance light emitting diode is more effectively cooled by these systems.