发明名称 Plasma processing apparatus and method
摘要 A plasma processing apparatus for plasma-processing a substrate arranged in a reaction chamber using a high frequency power supplied by a high frequency power introduction means, wherein said high frequency power introduction means comprises a cathode electrode and a conductor portion capable of transmitting a high frequency power to said cathode electrode, said conductor portion being penetrated a wall of said reaction chamber while said conductor portion being electrically isolated from said wall of said reaction chamber by means of an insulating material, at least a part of said insulating material comprising a porous ceramic material, wherein a fluid is introduced through said porous ceramic material to control the temperature of said cathode electrode and/or that of said conductor portion.
申请公布号 US6165274(A) 申请公布日期 2000.12.26
申请号 US19980184044 申请日期 1998.11.02
申请人 CANON KABUSHIKI KAISHA 发明人 AKIYAMA, KAZUYOSHI;AOIKE, TATSUYUKI;SHIRASUNA, TOSHIYASU;TAKADA, KAZUHIKO;OKAMURA, RYUJI;MURAYAMA, HITOSHI
分类号 G03G5/08;C23C16/44;C23C16/50;C23C16/509;H01J37/32;H01L21/205;H01L31/04;(IPC1-7):C23C16/00 主分类号 G03G5/08
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