发明名称 Film substrate, fabrication method thereof, and image display substrate
摘要 In a film substrate (FB) including a film base material ( 1 ) and conductor wiring ( 23 ) that is formed on the film base material ( 1 ), the conductor wiring ( 23 ) is arranged such that the conductor wiring thickness of an external connection portion on the film substrate to which another panel or substrate is connected is thicker than the conductor wiring thickness of conductor wiring portions (bent portions) ( 25 ) at other positions.
申请公布号 US7425766(B2) 申请公布日期 2008.09.16
申请号 US20050043946 申请日期 2005.01.28
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 IMAMURA HIROYUKI
分类号 H01L21/60;H01L23/12;G02F1/13;G02F1/1345;H01L23/34;H01L23/498;H05K1/00;H05K1/02;H05K1/11;H05K3/00;H05K3/10;H05K3/24;H05K3/36 主分类号 H01L21/60
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