发明名称 |
Wire bonding system and method of use |
摘要 |
A semiconductor package wire bonding system and method of use are provided. The wire bonding system includes a heating block that heats and supports a printed circuit board on which a multi-layered semiconductor chip structure having an overhang is mounted. A support inserted through an opening in the printed circuit board supporting the overhang portion of the semiconductor chip structure is installed in a predetermined region of the heating block. Multiple supports on the heating block may support overhand portions on multiple semiconductor chip structures.
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申请公布号 |
US7425466(B2) |
申请公布日期 |
2008.09.16 |
申请号 |
US20070679730 |
申请日期 |
2007.02.27 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD |
发明人 |
LIM WON-CHUL |
分类号 |
H01L21/44;H01L21/60;H01L23/02;H01L25/065 |
主分类号 |
H01L21/44 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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