发明名称 Method for fabricating a capacitor structure
摘要 A capacitor structure is described, including a substrate, a first metal layer in the substrate, an etching stop layer on the substrate having therein an opening that exposes a portion of the first metal layer, a connection layer on the portion of the first metal layer, the sidewall of the opening and a portion of the etching stop layer, a second metal layer over the connection layer, and an insulating layer between the second metal layer and the connection layer.
申请公布号 US7422954(B2) 申请公布日期 2008.09.09
申请号 US20060308237 申请日期 2006.03.14
申请人 UNITED MICROELECTRONICS CORP. 发明人 TSAI MINGSHANG
分类号 H01L21/20 主分类号 H01L21/20
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