发明名称 Post passivation interconnection process and structures
摘要 A system and method for forming post passivation metal structures is described. Metal interconnections and high quality electrical components, such as inductors, transformers, capacitors, or resistors are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
申请公布号 US7423346(B2) 申请公布日期 2008.09.09
申请号 US20040937543 申请日期 2004.09.09
申请人 MEGICA CORPORATION 发明人 LIN MOU-SHIUNG;CHOU CHIU-MING;CHOU CHIEN-KANG
分类号 H01L23/48;H01L23/52 主分类号 H01L23/48
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