| 发明名称 |
ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER |
| 摘要 |
<p>Provided is an adhesive composition which contains an adhesive ingredient, conductive particles and insulating particles. The ratio (Ri/Rc) of the average particle diameter (Ri) of the insulating particle to the average particle diameter (Rc) of the conductive particle is 120-300%.</p> |
| 申请公布号 |
KR20080081353(A) |
申请公布日期 |
2008.09.09 |
| 申请号 |
KR20087018406 |
申请日期 |
2006.12.14 |
| 申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
TATSUZAWA TAKASHI;KOBAYASHI KOUJI;FUJINAWA TOHRU;FUKUSHIMA NAOKI |
| 分类号 |
C09J9/02 |
主分类号 |
C09J9/02 |
| 代理机构 |
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代理人 |
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| 主权项 |
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