| 摘要 |
A printed wiring board on which a pattern can be formed favorably by printing and soldering even where a small part of the 1005 size or less is mounted. The printed wiring board includes a substrate; a pair of soldering lands on the substrate, the soldering lands being spaced from one another with a first side of one land opposing a first side of another land; and a mounted part having a pair of electrodes on opposite ends thereof soldered to the respective lands. A wiring line is connected to each soldering land, and an insulating element overlies the wiring lines. The insulating element has openings formed so as to expose the soldering lands therethrough. Wiring line connection elements are individually connected to only the first sides of the lands. Each insulating element opening has an edge positioned outside of the corresponding land and on the inner side of the corresponding wiring line connection element.
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