发明名称 |
PRINTED CIRCUIT BOARD FOR IMPROVING TOLERANCE OF EMBEDDED CAPACITORS, AND PROCESS FOR MANUFACTURING THE SAME |
摘要 |
<p>A PCB(Printed Circuit Board) for improving tolerance of an embedded capacitor and a manufacturing method thereof are provided to exclude a flat coating process and to improve adhesion between a substrate and the embedded capacitor by inserting a circuit layer including a lower electrode into a resin insulating layer. A manufacturing method of a PCB with an embedded capacitor includes the steps of: preparing a metal plate having a first circuit layer on one surface through an additive process, wherein the first circuit layer has a lower electrode and a circuit pattern; preparing a PCB having a resin insulating layer(202) on an inner layer(201); stacking the metal plate having the first circuit layer on the resin insulating layer of the PCB; exposing the first circuit layer and the resin insulating layer by removing the metal plate in a thickness direction; stacking a dielectric sheet, which is composed of a dielectric layer(301) having a metal layer for a second circuit layer on one surface, on the exposed first circuit layer and resin insulating layer; forming the second circuit layer including an upper electrode(303) and a circuit pattern by patterning the metal layer for the second circuit layer; forming a via to connect the circuit layers including the upper and lower electrodes electrically; and forming an outer circuit layer(308) through a build up process.</p> |
申请公布号 |
KR20080080788(A) |
申请公布日期 |
2008.09.05 |
申请号 |
KR20070020958 |
申请日期 |
2007.03.02 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM, TAE EUI;MIN, BYOUNG YOUL;KANG, MYUNG SAM;YOO, JE GWANG |
分类号 |
H05K1/16;H05K3/46 |
主分类号 |
H05K1/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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