METHOD FOR MANUFACTURING CIRCUIT BOARD

摘要

A method for manufacturing a printed circuit board is provided to form a circuit pattern with a high density by forming an embossed carving pattern on a metal layer of a carrier and transferring the embossed carving pattern to an insulated layer. A method for manufacturing a printed circuit board includes the steps of: forming an embossed carving pattern corresponding to a circuit pattern on a metal layer of a carrier(S100); stacking and compressing the carrier on the insulated layer so that the embossed carving pattern faces toward the insulated layer(S200); removing the carrier, and transferring the metal layer and the embossed carving pattern to the insulated layer(S300); forming a via-hole on the insulated layer to which the metal layer is transferred(S400); forming a seed layer on the via-hole(S500); and filling the via-hole and forming a plating layer on the metal layer by performing an electrolytic plating for the insulated layer to which the metal layer is transferred using the metal layer and the seed layer as an electrode(S600).