| 摘要 |
A method and an apparatus for manufacturing a probe card are provided to bond probes with a loading chuck in small pitches by sucking in one surface of the probe and fixing the probe on the loading chuck. An apparatus for manufacturing a probe card includes a collet chuck(20), a substrate chuck(30), and a bonding unit. The collet chuck sucks in one surface of a probe and fixes the probe. The substrate chuck fixes a substrate, on which the probe is to be bonded. The bonding unit bonds the probe on the substrate. The probe is loaded on a loading chuck, which delivers the probe to the collet chuck. The loading chuck fixes the probe in a horizontal state on an upper surface thereof. The loading chuck is rotated by 90 degrees, such that the fixed probe is erected. |
