| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component and a method of manufacturing an electronic device using the electronic component in which an electronic component can be mounted even without soldering connecting pads of a wiring board, connecting pads of the wiring board can be disposed at narrow pitches, and even an electronic component comprising electrode projections formed at narrow pitches can also be mounted while preventing connecting electrodes from being electrically short-circuited. <P>SOLUTION: The present invention relates to a method of manufacturing an electronic component comprising soldered connecting electrodes in electrode projections 12, including the steps of: heating a solder sheet 20 into a semi-molten state and pushing an electronic component 10 in contact with the solder sheet 20 to contact the electrode projections 12 onto the solder sheet 20; and separating the electronic component 10 from a position where the electrode projections 12 are brought into contact with the solder sheet 20, to transfer a solder 20a on outer surfaces of the electrode projections 12 in contact with the solder sheet 20. <P>COPYRIGHT: (C)2008,JPO&INPIT |
