| 摘要 |
PROBLEM TO BE SOLVED: To provide a dicing method of a semiconductor wafer capable of cutting with high quality by preventing sticking of contamination during dicing, without impairing significant facility modification or degradation in blade life. SOLUTION: In the dicing method of a semiconductor wafer 2, the semiconductor wafer 2 in which a plurality of circuit elements 4 are arrayed is cut along a cutting line 10 between the circuit elements, for cutting out a circuit element, there are included a photosensitive resin applying process in which a photosensitive resin is coated on the entire surface of the semiconductor wafer 2 to form a photosensitive resin layer 6; an exposure process in which the photosensitive resin layer 6 is exposed and photosensitized by using an exposure mask 8 corresponding to the cutting line 10; a development process in which the photosensitive resin layer 6 is removed along the cutting line 10, by developing the photosensitive resin layer 6; and a cutting process in which the semiconductor wafer 2 is cut along the cutting line 10 to cut out semiconductor elements in pieces and forming a semiconductor chip 26. COPYRIGHT: (C)2008,JPO&INPIT
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