| 摘要 |
PROBLEM TO BE SOLVED: To perform nondestructive and noncontact measurement of the thickness of the film applied on the substrate. SOLUTION: The film thickness measuring device of this invention for measuring the film thickness of the material applied on the substrate is characteristically composed of the fixing part for fixing the substrate, the chamber for isolating the substrate externally, the light source for irradiating the substrate with slit light by generating slit light, and the detecting part for detecting the reflected light from the substrate. The film thickness measuring method is provided for characteristically detecting the sectional profile lines by fixing the substrate in the chamber, and for irradiating the substrate with the slit light. COPYRIGHT: (C)2008,JPO&INPIT
|
