发明名称 Heat Transfer Device and Manufacturing Method Thereof Using Hydrophilic Wick
摘要 Provided is a flat panel type heat transfer device for effectively dissipating heat generated from a heat source in contact with a casing, comprising the casing sealed and having a certain shape, a coolant loaded in the casing and undergoing phase transition, one or more flat panel type hydrophilic wick structures in contact with at least a portion of an inner surface of the casing, manufactured by aggregating fibers capable of absorbing the coolant, and providing a coolant passage leading the coolant to flow in a direction parallel to the inner surface of the casing, and one or more support structures, each having a plurality of through holes which provide coolant passages through which coolant in a vapor phase or a liquid phase flows, while supporting the hydrophilic wick structure such that the hydrophilic wick structure is in close contact with the inner surface of the casing, wherein the coolant fills a portion of a space in the casing and circulates in the space in a manner such that the coolant flows through the hydrophilic wick structure by means of capillary force generated in fine passages formed in the hydrophilic wick structure toward a relatively hot point, is evaporated by heat from a heat source, flows in a vapor phase toward a relatively low temperature point, condenses at the relatively low temperature point, flows back in a liquid phase to the relatively hot point, and repeats the cycle of evaporation and condensation.
申请公布号 US2008210407(A1) 申请公布日期 2008.09.04
申请号 US20060813423 申请日期 2006.01.05
申请人 CELSIA TECHNOLOGIES KOREA INC. 发明人 KIM JONG JIN;JANG SUNG WOOK;LIM JONG SOO;AN YOUNG GIL;LEE JEONG HYUN;CHOI JAE JOON
分类号 F28D15/02;B23P15/26 主分类号 F28D15/02
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