| 摘要 |
Methods and apparatus are disclosed for direct measurement of the tensile strength of joints with use of laser spallation. A laser pulse is directed at a surface in communication with a solder joint, generating a stress wave to separate the solder ball from its underlying structure. The solder joint may be measured either prior to joining of a PCB board or CSP package, or after they have been joined. The joints for testing may be prepared by polishing either the PC board or the CSP package to expose the desired solder joint for testing. The tensile strength of the embedded joints may also be measured in-situ.
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