发明名称 |
Apparatus and method for fabricating semiconductor devices and substrates |
摘要 |
An apparatus and method for fabricating semiconductor devices may increase reliability of the semiconductor devices by decreasing generation of particles and enhancing operation efficiency by decreasing the number of cleanings. The apparatus may include a chamber having a cover plate, susceptors for securely placing semiconductor substrates within the chamber, shower heads located on the cover plate to supply reaction gases into the chamber, and a curtain gas line connected to the cover plate to supply heated curtain gases between the shower heads.
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申请公布号 |
US2008214012(A1) |
申请公布日期 |
2008.09.04 |
申请号 |
US20080007517 |
申请日期 |
2008.01.11 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK JIN-HO;CHEONG SEONG-HWEE;CHOI GIL-HEYUN;LEE SANG-WOO;LEE HO-KI |
分类号 |
H01L21/302;C23C16/455 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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