| 摘要 |
<p>The drive mechanism (2) has a guide rail (20), a slide body (21), which remains in sliding engagement with the guide rail with a drive device (22) for moving the slide body along the guide rail, and an active element (23), which is fixed on the slide body. The drive device has a pipe-shaped section for receiving a ball bearing, and an outer ring elastic body is arranged on the inner periphery of the pipe-shaped section. An outer ring of the ball bearing is held to slide in axial direction of the feed spindle shaft (24), and interrupts vibrations of the feed spindle shaft. An independent claim is also included for cutting device for cutting a wafer.</p> |
