| 发明名称 |
INKJET DEVICE ENCAPSULATED AT THE WAFER SCALE |
| 摘要 |
<p>Micro-fabricated devices (152) is packaged at the wafer (150) stage with a cap (156, 160) applied to one or both sides of the wafer (150) prior to separation of the wafer into separate devices. The cap (156) on the top side overlays the respective device(s) (152), except the bond pads (158). The cap (160) on the bottom overlays all of the respective device(s) (152).</p> |
| 申请公布号 |
WO02056360(A1) |
申请公布日期 |
2002.07.18 |
| 申请号 |
WO2002AU00014 |
申请日期 |
2002.01.08 |
| 申请人 |
SILVERBROOK RESEARCH PTY. LTD.;SILVERBROOK, KIA |
发明人 |
SILVERBROOK, KIA |
| 分类号 |
H01L23/02;B41J2/04;B41J2/14;B41J2/16;B81B7/00;H01L23/04;(IPC1-7):H01L21/52;H01S5/022;B81C1/00;B81B7/04 |
主分类号 |
H01L23/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
