| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of polishing a semiconductor wafer which can prevent a suction mark from remaining on a semiconductor wafer due to difference of material between a permeable chuck plate and an unpermeable partition member in a universal chuck having a partition member. <P>SOLUTION: A ringlike groove 1a is made in the lower surface of a chuck plate 1 formed of a permeable member and an unpermeable ringlike partition member 3 is fitted therein. A chuck holder 2 is formed of an unpermeable member and by using a universal chuck having an inside fluid conduction portion 4 and an outside fluid conduction portion 5 for connection with the partition member 3, a semiconductor wafer W is vacuum chucked over the inside and the outside of the partition member 3 to bring about a negative pressure in both the inside fluid conduction portion 4 and the outside fluid conduction portion 5 during polishing operation, or the semiconductor wafer W is vacuum chucked only to the inside of the partition member 3 to bring about a negative pressure in the inside fluid conduction portion 4 and to pressurize the outside fluid conduction portion 5 during polishing operation. <P>COPYRIGHT: (C)2008,JPO&INPIT |
