发明名称 METHOD OF FABRICATING GRAYSCALE MASK USING WAFER BONDING PROCESS
摘要 <P>PROBLEM TO BE SOLVED: To inexpensively fabricate a high-quality grayscale mask. <P>SOLUTION: This method includes steps of: depositing a layer of Si<SB>3</SB>N<SB>4</SB>on a quartz wafer; depositing a layer of titanium/TEOS on the Si<SB>3</SB>N<SB>4</SB>layer on the backside of the quartz wafer; removing the layer of Si<SB>3</SB>N<SB>4</SB>from the front side of the quartz wafer; depositing a layer of SRO (silicon rich oxide) on the front side of the quartz wafer; patterning a microlens array on the SRO layer; forming a microlens array in the SRO layer; depositing a layer of titanium; patterning and etching the titanium layer; depositing a layer of SiO<SB>x</SB>N<SB>y</SB>on the microlens array; planarizing the layer of SiO<SB>x</SB>N<SB>y</SB>; removing the titanium/TEOS layer from the backside of the quartz wafer; bonding the planarized SiO<SB>x</SB>N<SB>y</SB>layer to a quartz reticle plate; and removing Si<SB>3</SB>N<SB>4</SB>from the bonded structure to form a grayscale mask reticle. <P>COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008203851(A) 申请公布日期 2008.09.04
申请号 JP20080033683 申请日期 2008.02.14
申请人 SHARP CORP 发明人 GAO WEI;ULRICH BRUCE D;YOSHI ONO
分类号 G03F1/08 主分类号 G03F1/08
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