发明名称 |
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of forming a sufficiently flat insulating film without performing a reflow process. SOLUTION: The method of manufacturing the semiconductor device has: a step of growing an insulating film 32a in a state where the inside of a deposition chamber is set at a first pressure; a step of adjusting pressure in which the pressure of the inside of the deposition chamber is made to lower gradually to a second pressure lower than the first pressure; and a step of further growing the insulating film 32b in a state where the pressure of the inside of the deposition chamber is set at the second pressure. COPYRIGHT: (C)2008,JPO&INPIT
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申请公布号 |
JP2008205502(A) |
申请公布日期 |
2008.09.04 |
申请号 |
JP20080112314 |
申请日期 |
2008.04.23 |
申请人 |
FUJITSU LTD;SPANSION LLC |
发明人 |
NAGAKURA YOSHIMASA;OHASHI HIDEAKI |
分类号 |
H01L21/316;C23C16/42;C23C16/455 |
主分类号 |
H01L21/316 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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