发明名称 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device capable of forming a sufficiently flat insulating film without performing a reflow process. SOLUTION: The method of manufacturing the semiconductor device has: a step of growing an insulating film 32a in a state where the inside of a deposition chamber is set at a first pressure; a step of adjusting pressure in which the pressure of the inside of the deposition chamber is made to lower gradually to a second pressure lower than the first pressure; and a step of further growing the insulating film 32b in a state where the pressure of the inside of the deposition chamber is set at the second pressure. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205502(A) 申请公布日期 2008.09.04
申请号 JP20080112314 申请日期 2008.04.23
申请人 FUJITSU LTD;SPANSION LLC 发明人 NAGAKURA YOSHIMASA;OHASHI HIDEAKI
分类号 H01L21/316;C23C16/42;C23C16/455 主分类号 H01L21/316
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