发明名称 METHOD FOR MANUFACTURING SOI WAFER
摘要 PROBLEM TO BE SOLVED: To provide an easy method and the like for manufacturing an SOI wafer low in cost and having a partial SOI structure. SOLUTION: A method for manufacturing the SOI wafer having the partial SOI structure from a silicon single-crystal wafer includes at least: a step for forming a groove pattern on a surface of the silicon single-crystal wafer; a step for forming a silicone oxide film on the bottom of the formed groove pattern; and a step for performing an RTA treatment of the silicon single-crystal wafer having the groove pattern having the formed-on-the-bottom silicon oxide film in an atmosphere of hydrogen gas, an inert gas, or a mixed gas of them, forming a silicon single-crystal thin film on the formed-on-the-bottom silicon oxide film, and forming the partial SOI structure as an oxide film with the formed-on-the-bottom silicon oxide film embedded. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008205358(A) 申请公布日期 2008.09.04
申请号 JP20070042059 申请日期 2007.02.22
申请人 SHIN ETSU HANDOTAI CO LTD 发明人 KOBAYASHI NORIHIRO;ISHIZUKA TORU
分类号 H01L21/02;H01L27/12 主分类号 H01L21/02
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