| 摘要 |
PROBLEM TO BE SOLVED: To mount an option board on a main board in a high-density manner. SOLUTION: A plurality of memory modules 18 are mounted to a sub-board 16 with gaps which are larger than thicknesses of the memory modules, and when a plurality of the sub-boards 16 are mounted to the main board 12, the memory modules 18 forms nests with one inside another. By such a constitution, the packaging density of the memory modules 18 to the main board 12 becomes higher as compared when a plurality of the memory modules 18 are directly aligned and mounted to the main board 12, or when the sub-boards 16 with a plurality of the memory modules 18 mounted are mounted to the main board 12 so that the memory modules 18 may not overlap one another. COPYRIGHT: (C)2008,JPO&INPIT
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