| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for easily and visually determining which chip has a normal exposure condition, and which chip has an abnormal exposure condition in an FEM wafer. SOLUTION: A characteristic amount in the shape of cross-section of resist pattern of the FEM wafer is calculated for each chip region of the FEM wafer from an image of resist pattern of the FEM wafer. The characteristic amount in the shape of cross-section is displayed for each chip in a list of chips as a map showing locations of chip regions of the FEM wafer. In the list of chips, a deviation of the characteristic amount in the shape of cross-section of resist pattern of the FEM wafer for the adequate value is shown with color-display images. COPYRIGHT: (C)2008,JPO&INPIT
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