| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that, when a high frequency module is mounted on a master substrate, on the master substrate, the area occupied by the high frequency module is large, a mount density on the master substrate is low, and the scale is expanded. SOLUTION: A high frequency module comprises a circuit board 49, a rear side component 57 mounted on a rear side of the circuit board 49, a front side component 47 mounted on a front side thereof, and a top surface conductor 81 covering the front side component 47. The high frequency module further includes a terminal line substrate 69 which is connected with the rear side component 57 and mounted on the rear side of the circuit board 49, wherein a section 147b provided along an outer circumference of the terminal line substrate 69 and a section 147a provided along an outer circumference of the circuit board 49 are disposed side by side on the same plane. Thus, the sections 147a, 147b of the circuit board 49 and the terminal line substrate 69 are arranged on one straight line and any step or the like is not generated, thereby improving dimensional accuracy of an outer form of the high frequency module 23. Therefore, miniaturization can be achieved. COPYRIGHT: (C)2008,JPO&INPIT
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