| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing semiconductors used for sealing semiconductor elements that is excellent in heat resistant reliability as well as in continuous moldability, and a semiconductor device obtained from the same. SOLUTION: The epoxy resin composition for sealing semiconductors comprises an epoxy resin, a curing agent and an inorganic filler, where the epoxy resin composition comprises as the curing agent a phenolic resin represented by formula (1) (wherein R<SB>1</SB>-R<SB>14</SB>are each an atom or a group selected from among hydrogen atom, a hydroxy group and alkyl groups, and R<SB>1</SB>-R<SB>5</SB>, R<SB>6</SB>-R<SB>9</SB>and R<SB>10</SB>-R<SB>14</SB>each contain at least two hydroxy groups; and n is an integer of 0-3). COPYRIGHT: (C)2008,JPO&INPIT
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