摘要 |
There is disclosed a fixing method of an electronic component or the like in which when the electronic component and a resin layer are fixed, warp and bend of the electronic component can be inhibited. During manufacturing of a semiconductor-embedded substrate 200 in which a semiconductor device 220 is embedded, after the semiconductor device 220 is disposed on an unhardened resin layer 212 , this device is stored in a container 31 of a pressurizing and heating unit 3 , and the semiconductor device 220 is isotropically pressurized using an internal gas in the container 31 as a pressure medium, whereby the semiconductor device 220 is pressed to the unhardened resin layer 212 , and the resin layer 212 is heated to harden. In consequence, the semiconductor device 220 is fixed and mounted on the resin layer 212 without being warped or bent.
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