METHODS TO PRODUCE HIGH DENSITY, MULTILAYER PRINTED WIRING BOARDS FROM PARALLEL-FABRICATED CIRCUITS AND FILLED VIAS

摘要

The invention provides methods to mass laminate and interconnect high density interconnect circuit layers fabricated through parallel processing. Invention methods employ an inside-out interconnection strategy that eliminates plating of vias and provides defect-free outer circuit layers. Conductive paste and via layers are also key features of the invention.