CMP SLURRY FOR SILICON FILM

摘要

Provided is a CMP slurry for silicon films, and by using such slurry, polishing speeds and polishing speed ratios of a silicon film, a silicon nitride film and a silicon oxide film required for performing CMP are obtained. In the CMP, one type of slurry is used for forming a contact plug by self-alignment to reduce semiconductor element manufacturing cost and improve yield. The slurry contains abrasive grains, a cationic surfactant and water and has a pH value of 6.0-8.0.