THREE-DIMENSIONAL ELECTRONIC DEVICE AND RELATIVE MANUFACTURE METHOD

摘要

There is described a three-dimensional electronic device (10) having a first and a second electronic circuit (12, 14) stacked one on top of the other and having respective contact pads (22); and a substantially C-shaped spacer member (26) made of electrically conducting material and extending between the first and second electronic circuit (12, 14) to connect a first contact pad (22a) of the first integrated circuit (12) electrically to a second contact pad (22b) of the second integrated circuit (14).