发明名称 |
POLISHING PAD GROOVE PROCESSING MACHINE, AND POLISHING PAD GROOVE PROCESSING METHOD |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a machine and method for a polishing pad groove processing, in which chips produced by cutting are securely removed from a tool so that groove processing is stably performed. <P>SOLUTION: The polishing pad groove processing machine cuts a number of grooves in the surface of a polishing pad 1. It comprises: a cutting device 2, comprising a multiple blade tool with a plurality of cutting blades 8 aligned and projected, in such a way that the cutting blades 8 are displaceable between a cutting position closer to the surface of the polishing pad 1 and a non-cutting position 2 apart from it; air blow devices 3 and 4 to blow air to the cutting blades 8 for cooling them; a dust collecting machine 5 to suck and recover chips produced by cutting; a cleaning device 6 comprising a brush 9 displaceable between a cleaning position closer to the cutting blades 8 in the non-cutting position and a stand-by position apart from them; and a control device 7 to control displacement of the brush 9 at least. <P>COPYRIGHT: (C)2008,JPO&INPIT |
申请公布号 |
JP2008200767(A) |
申请公布日期 |
2008.09.04 |
申请号 |
JP20070036398 |
申请日期 |
2007.02.16 |
申请人 |
TOYO TIRE & RUBBER CO LTD |
发明人 |
KIMURA TAKESHI;SHIMOMURA TETSUO;KAZUNO ATSUSHI;NAKAI YOSHIYUKI;OGAWA KAZUYUKI |
分类号 |
B23B5/48;B23Q11/00;B24B37/20;H01L21/304 |
主分类号 |
B23B5/48 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|