| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of producing a lead type chip capacitor, which remarkably reduces manufacturing processes needed. SOLUTION: The method of manufacturing an electric component of lead type is disclosed. The component is set in a lead frame having end paste applied to selected portions of the lead frame. By baking the assembly of the lead frame and the electric component, the electric component are concurrently terminated and thereby strongly secured leads are provided. COPYRIGHT: (C)2008,JPO&INPIT
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