BONDING APPARATUS, AND BONDING METHOD

摘要

Provided is a bonding apparatus (10) for bonding the electrode of a semiconductor die (12) and the electrode of a circuit substrate (19) by means of metallic nano paste. The bonding apparatus (10) comprises a bump forming mechanism (20) for forming bumps by injecting fine droplets of the metallic nano paste onto the electrodes, a primary bonding mechanism (50) for bonding the individual electrodes primarily in an inconductive state by pushing the bumps of the semiconductor die (12) onto the bumps of the circuit substrate (19), and a secondary bonding mechanism (80) for bonding the individual electrodes secondarily to become conductive by pushing and heating the primarily bonded bumps in the bonded direction thereby to push and sinter the metallic nano particles of the individual bumps. As a result, it is possible to reduce the bonding loads and to bond the individual electrodes efficiently by the convenient method.