SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

摘要

A substrate (1) and a semiconductor chip (5) are flip-chip bonded. The periphery of a connecting pad (3) of the substrate (1) and an input/output terminal (10) of the semiconductor chip (5) is filled with an underfill material (7), i.e., a complex of a filler, which has a maximum grain diameter of 5µm or less and is contained by 40-60 mass%, and a resin. One main surface of the substrate (1) and a side surface of the semiconductor chip (5) not covered with the underfill material (7) are sealed with a molding material (8), i.e., a complex of a filler contained by 75 mass% and a resin having a glass transition temperature of 180°C or higher. The substrate (1) covered with the molding material (8) and the semiconductor chip (5) are integrally thinned from the top and the bottom.