| 摘要 |
<p>Disclosed is a polishing composition containing ammonium hydroxide, an ammonium salt and an organic acid, which enables polishing at a higher speed than the conventional compositions. The polishing composition realizes polishing at a still higher speed by additionally containing an oxidizing agent. When the polishing composition further contains an anticorrosive agent, dishing is suppressed. In this polishing agent, an amino acid is preferable as the organic acid, hydrogen peroxide is preferable as the oxidizing agent, and a tetrazole derivative is preferable as the anticorrosive agent. Consequently, there is provided a polishing composition which enables high-speed polishing while suppressing dishing.</p> |
