发明名称 WARPAGE ANALYSIS METHOD, ITS PROGRAM, AND WARPAGE ANALYSIS DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a method and device for simply and precisely predicting the shrinkage rate and warpage quantity of a molding in the injection molding process. SOLUTION: In order to analyze the warpage of the molding, the total warpage quantity is calculated on the basis of (1) a branching structure warpage quantity obtained from the angle between a base part and a branching body in a branching part, the wall-thicknessward average of an inward shrinkage rate in a branching part, etc., and (2) a bimetal warpage quantity obtained from the inward and wall-thicknessward distribution of the inward shrinkage rates of the base part and the branching part in the branching part. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008200859(A) 申请公布日期 2008.09.04
申请号 JP20070035853 申请日期 2007.02.16
申请人 TORAY IND INC 发明人 MITSUHATA HARUHIKO;SAWADA SATOSHI
分类号 B29C45/76;B29C45/26 主分类号 B29C45/76
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