| 发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device by which yield can be improved compared to a conventional method and to provide an adhesive sheet which is used for the method. <P>SOLUTION: The method for manufacturing the semiconductor device has a temporarily fixing process in which a semiconductor element is temporarily fixed to an adherend through the adhesive sheet, a partially hardening process in which the adhesive sheet is heated under predetermined conditions into a partially hardened state so that it may exhibit a shear adhesive strength equal to or more than 0.5 MPa with respect to the adherend and a wire bonding process in which the semiconductor element is wire bonded with the adhesive sheet being partially hardened. <P>COPYRIGHT: (C)2008,JPO&INPIT |
| 申请公布号 |
JP2008205195(A) |
申请公布日期 |
2008.09.04 |
| 申请号 |
JP20070039667 |
申请日期 |
2007.02.20 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
ARAI ASAMI;MATSUMURA TAKESHI;MISUMI SADAHITO |
| 分类号 |
H01L21/52;C09J7/00;C09J133/00;C09J161/06;C09J163/00;C09K3/10;H01L21/60;H01L25/065;H01L25/07;H01L25/18 |
主分类号 |
H01L21/52 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
