| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a component built-in substrate whose curvature can be suppressed even when the substrate is a thin type, and a manufacturing method thereof. <P>SOLUTION: On one surface of the substrate 1, an electronic component 6 such as a bare chip is mounted facedown. The electronic component 6 is composed of a circuit portion 4 where a semiconductor integrated circuit is formed and a connection terminal 5 formed on the circuit portion 4. On the other surface of the substrate 1, an electronic component 11 such as a bare chip is mounted facedown. The electronic component 11 is composed of a circuit portion 9 where a semiconductor integrated circuit is formed and a connection terminal 10 formed on the circuit portion 9. The electronic component 6 and electronic component 11 have mutually matching structures. Further, the electronic components 6 and 11 are disposed plane symmetrically with respect to the substrate 1. Wirings 15 etc., are also disposed plane symmetrically with respect to the substrate 1. Namely, a structure disposed above the substrate 1 and a structure disposed below it are plane symmetrical with each other. <P>COPYRIGHT: (C)2008,JPO&INPIT |
