| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package, an integrated circuit card having this semiconductor package and its manufacturing method. <P>SOLUTION: This semiconductor package 20 has a base board 23 having a first through-hole 23a, a conductive pattern 24 covering the base board 23 and expanded on the first through-hole 23a, a semiconductor chip 22 facing the conductive pattern 24 and arranging at least its part in the first through-hole 23a, and a first external contact terminal 21 located in the first through-hole 23a and electrically connecting the conductive pattern 24 to the first semiconductor chip 22. Thus, durability of a package system or an IC card is improved, is made thin, the cost is reduced, and work can be simplified. <P>COPYRIGHT: (C)2008,JPO&INPIT</p> |
