| 摘要 |
The invention is concerned with new approaches to cooling processing equipment in data centers. A cooling system is described herein that is suitable for cooling processing equipment in data centers. The cooling system includes a vertical conduit carrying a cooling liquid and an array of elongate heat conducting elements, such as heat pipes, extending laterally outwardly from the conduit. An inner end portion of each heat conducting element is in thermal contact with cooling liquid flowing in the conduit and an outer end portion of each heat conducting element is adapted for conductive thermal contact with at least one heat producing electronic component.
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