发明名称 JUMPER CHIP COMPONENT AND ITS MANUFACTURING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a jumper chip component in which corrosive disconnection due to hydrogen sulfide gas or the like never occurs and which can be obtained with an extremely low resistance value, and provide its manufacturing method. <P>SOLUTION: This jumper chip component is equipped with a conductor 23 formed on the rear face of a rectangular insulation substrate 21, and a pair of end face electrodes 24 formed on both end faces of the insulation substrate 21 so as to be electrically connected to this conductor 22. The conductor 23 is formed by a sputter film on the nearly entire upper face of the insulation substrate 21, an insulation film 22 having a color different from that of the insulation substrate 21 is formed on the rear face of the insulation substrate 21, and furthermore, plating layers 25, 26 are formed which cover the entire surfaces of the conductor 23 and the pair of the end face electrodes 24. <P>COPYRIGHT: (C)2008,JPO&INPIT</p>
申请公布号 JP2008204685(A) 申请公布日期 2008.09.04
申请号 JP20070037552 申请日期 2007.02.19
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 TAKASHIMA HISAHIRO;TSUDA SEIJI
分类号 H01R11/01;H01C13/00;H01C17/06;H01R31/08;H01R43/00 主分类号 H01R11/01
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